Sequans Communications and NXP Semiconductors are collaborating to bring LTE for IoT connectivity to NXP’s microcontroller (MCU) ecosystem to accelerate the adoption of cellular connectivity. The companies are combining NXP’s LPC5500 series microcontroller with Sequans’ Monarch GM01Q and NB01Q modules to give IoT device makers a development platform that speeds time to market for connected IoT devices.
NXP customers who are using the LPC5500 series MCU now have a single solution to add LTE-M or NB-IoT connectivity to their products.
The NXP LPC5500 series development board provides an ideal platform for product evaluation or prototyping. It is based on the Arm Cortex-M33 architecture and includes a high-performance onboard debug probe, audio subsystem, accelerometer and several options for add-on boards for networking, sensors, displays, and other interfaces.
For 5G/4G massive IoT applications, Sequans provides a comprehensive product portfolio based on its Monarch LTE-M/NB-IoT and Calliope Cat 1 chip platforms, featuring low power consumption, a large set of integrated functionalities, and global deployment capability.
For 5G/4G broadband and critical IoT applications, Sequans offers a product portfolio based on its Cassiopeia Cat 4/Cat 6 4G and high-end Taurus 5G chip platforms, optimized for low-cost residential, enterprise, and industrial applications. Founded in 2003, Sequans is based in Paris, France with additional offices in the United States, United Kingdom, Israel, Hong Kong, Singapore, Sweden, Taiwan, South Korea and China.
The LPCXpresso55S69 is fully supported by the MCUXpresso suite of tools, which provides device drivers, middleware and examples to allow rapid development, plus configuration tools and an optional free IDE. MCUXpresso software is compatible with the open source MCU operating system FreeRTOS, tools from popular tool vendors such as Arm and IAR, and the LPCXpresso55S69 may also be used with the popular debug probes available from SEGGER and P&E Micro.
“With this NXP/Sequans collaboration, we’re offering a best-in-class LTE for IoT plus MCU solution that is based on Sequans’ expertise in cellular IoT connectivity and NXP’s expertise in low-power MCUs,” said Didier Dutronc, Sequans CMO. “The result is an easy-to-use solution for IoT device development or prototyping that will work on LTE networks around the world on supported operators in the USA, Canada, Japan, Australia, and Europe.”
Sequans’ Monarch GM01Q and NB01Q modules are based on Sequans’ Monarch chip platform. The modules support 17 LTE bands for worldwide connectivity and include an LTE-optimized transceiver and a single-SKU RF front end. They deliver low power consumption with rock bottom power consumption at 1uA. Monarch GM01Q supports both LTE-M and NB-IoT, and NB01Q is optimized for NB-IoT only.
“Sequans’ leadership is well-established and their LTE for IoT chip solutions are well-proven,” said Tom Pannell, senior director of marketing for connectivity solutions at NXP. “As LTE for IoT demand grows across our customer base, having a pre-integrated platform that enables device makers to easily add LTE-M or NB-IoT connectivity to their designs will do much to drive the market. Combining the low power capabilities of Monarch and the high performance of LPC5500 series MCU results in a powerful solution for key market segments such as smart meters.”
